Silver
Molecular formula: |
Ag |
Molar mass: |
107.87 g·mol-1 |
Flandorfer, H., Saeed, U., Luef, C., Sabbar, A., Ipser, H.
Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag Sn, Cu Sn and Ni Sn intermetallic compounds
Thermochim. Acta
• Year: 2007
• Volume: 459
• Pages: 34-39.
Keywords:
Calorimetry, Enthalpy of formation, Lead-free solder alloy, Intermetallic compounds
DOI: 10.1016/j.tca.2007.04.004
ThermoML:
http://trc.nist.gov/ThermoML/tca/j.tca.2007.04.004.xml
|
|
|