Copper
| Molecular formula: | Cu |
| Molar mass: | 63.55 g·mol-1 |
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A. V. Blokhin, Y. U. Paulechka and G. J. Kabo Thermodynamic Properties of [C6mim][NTf2] in the Condensed State J.Chem.Eng.Data • Year: 2006 • Volume: 51 • Pages: 1377-1388. DOI: 10.1021/je060094d ThermoML: http://trc.nist.gov/journals/jced/2006v51/i04/je060094d.xml |
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M. R. Bissengaliyeva, D. B. Gogol, S. T. Taymasova and N. S. Bekturganov Measurement of Heat Capacity by Adiabatic Calorimetry and Calculation of Thermodynamic Functions of Standard Substances: Copper, Benzoic Acid, and Heptane (For Calibration of an Adiabatic Calorimeter) J. Chem. Eng. Data • Year: 2011 • Volume: 56 • Pages: 195-204. DOI: 10.1021/je100658y ThermoML: http://trc.nist.gov/ThermoML/10.1021/je100658y.xml |
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R. Stevens and J. Boerio-Goates Heat capacity of copper on the ITS-90 temperature scale using adiabatic calorimetry J. Chem. Thermodyn. • Year: 2004 • Volume: 36 • Pages: 857-863. Keywords: Copper, Heat capacity, Calorimetric standards, Adiabatic calorimetry DOI: 10.1016/2004steboe0 ThermoML: http://trc.nist.gov/journals/jct/2004v36/i10/2004steboe0.xml |
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H. Flandorfer, A. Sabbar, C. Luef, M. Rechchach and H. Ipser Enthalpies of mixing of liquid Bi Cu and Bi Cu Sn alloys relevant for lead-free soldering Thermochim. Acta • Year: 2008 • Volume: 472 • Pages: 1-10. Keywords: Lead-free solders, Enthalpy of mixing, Liquid alloys, Calorimetry, Bi-Cu, Bi-Cu-Sn DOI: 10.1016/j.tca.2008.02.023 ThermoML: http://trc.nist.gov/ThermoML/tca/j.tca.2008.02.023.xml |
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Flandorfer, H., Saeed, U., Luef, C., Sabbar, A., Ipser, H. Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag Sn, Cu Sn and Ni Sn intermetallic compounds Thermochim. Acta • Year: 2007 • Volume: 459 • Pages: 34-39. Keywords: Calorimetry, Enthalpy of formation, Lead-free solder alloy, Intermetallic compounds DOI: 10.1016/j.tca.2007.04.004 ThermoML: http://trc.nist.gov/ThermoML/tca/j.tca.2007.04.004.xml |
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D. Jendrzejczyk-Handzlik, M. Rechchach, W. Gierlotka, H. Ipser and H. Flandorfer Enthalpies of mixing of liquid systems for lead free soldering: Cu-Sb-Sn system Thermochim. Acta • Year: 2011 • Volume: 512 • Pages: 217-224. Keywords: Cu-Sb-Sn system, enthalpy of mixing DOI: 10.1016/j.tca.2010.10.010 ThermoML: http://trc.nist.gov/ThermoML/10.1016/j.tca.2010.10.010.xml |
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Di, J.-T. Chen and Z.-C. Tan Low-temperature heat capacities and standard molar enthalpy of formation of the solid-state coordination compound trans-Cu(Ala)2(s) (Ala = l- -alanine) Thermochim. Acta • Year: 2008 • Volume: 471 • Pages: 70-73. Keywords: Trans-Cu(Ala)2(s), Adiabatic calorimetry, Heat-capacity, Isoperibol solution-reaction calorimetry, Standard molar enthalpy of formation, UV spectroscopy DOI: 10.1016/j.tca.2008.02.024 ThermoML: http://trc.nist.gov/ThermoML/tca/j.tca.2008.02.024.xml |
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Knott, S., Li, Z., Mikula, A. Integral enthalpy of mixing of the liquid ternary Au Cu Sn system Thermochim. Acta • Year: 2008 • Volume: 470 • Pages: 12-17. Keywords: Thermodynamic, Calorimetry, Enthalpy of mixing DOI: 10.1016/j.tca.2008.01.014 ThermoML: http://trc.nist.gov/ThermoML/tca/j.tca.2008.01.014.xml |
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Z. Guo, M. Hindler, W. Yuan and A. Mikula Thermodynamic properties of liquid Au-Cu-Sn alloys determined from electromotive force measurements Thermochim. Acta • Year: 2011 • Volume: 525 • Pages: 183-189. Keywords: Au-Cu-Sn alloys, Activity, Thermodynamic properties, Electromotive force DOI: 10.1016/j.tca.2011.08.011 ThermoML: http://trc.nist.gov/ThermoML/10.1016/j.tca.2011.08.011.xml |
