Tin
Molecular formula: |
Sn |
Molar mass: |
118.71 g·mol-1 |
H. Flandorfer, A. Sabbar, C. Luef, M. Rechchach and H. Ipser
Enthalpies of mixing of liquid Bi Cu and Bi Cu Sn alloys relevant for lead-free soldering
Thermochim. Acta
• Year: 2008
• Volume: 472
• Pages: 1-10.
Keywords:
Lead-free solders, Enthalpy of mixing, Liquid alloys, Calorimetry, Bi-Cu, Bi-Cu-Sn
DOI: 10.1016/j.tca.2008.02.023
ThermoML:
http://trc.nist.gov/ThermoML/tca/j.tca.2008.02.023.xml
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Flandorfer, H., Saeed, U., Luef, C., Sabbar, A., Ipser, H.
Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag Sn, Cu Sn and Ni Sn intermetallic compounds
Thermochim. Acta
• Year: 2007
• Volume: 459
• Pages: 34-39.
Keywords:
Calorimetry, Enthalpy of formation, Lead-free solder alloy, Intermetallic compounds
DOI: 10.1016/j.tca.2007.04.004
ThermoML:
http://trc.nist.gov/ThermoML/tca/j.tca.2007.04.004.xml
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Rechchach, M., Sabbar, A., Flandorfer, H., Ipser, H.
Enthalpies of Mixing of Liquid In-Sn and In-Sn-Zn Alloys
Thermochim. Acta
• Year: 2010
• Volume: 502
• Pages: 66-72.
Keywords:
Enthalpy of mixing, lead free solders, liquid alloys, calorimetry, In-Sn, In-Sn-Zn
DOI: 10.1016/j.tca.2010.02.008
ThermoML:
http://trc.nist.gov/ThermoML/10.1016/j.tca.2010.02.008.xml
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