Chemical compounds with formula Sn in ThermoML

tin
F. Meydaneri, B. Saatci and M. Ozdemir
Thermal conductivities of solid and liquid phases for pure Al, pure Sn and their binary alloys
Fluid Phase Equilib.Year: 2010Volume: 298Pages: 97-105.
Keywords: Thermal conductivity, Radial heat flow, Directional solidification, Sn Al alloy, Thermal coefficient
DOI: 10.1016/j.fluid.2010.07.015
ThermoML: http://trc.nist.gov/ThermoML/fpe/j.fluid.2010.07.015.xml
tin
Knott, S., Li, Z., Mikula, A.
Integral enthalpy of mixing of the liquid ternary Au Cu Sn system
Thermochim. ActaYear: 2008Volume: 470Pages: 12-17.
Keywords: Thermodynamic, Calorimetry, Enthalpy of mixing
DOI: 10.1016/j.tca.2008.01.014
ThermoML: http://trc.nist.gov/ThermoML/tca/j.tca.2008.01.014.xml
tin
H. Flandorfer, A. Sabbar, C. Luef, M. Rechchach and H. Ipser
Enthalpies of mixing of liquid Bi Cu and Bi Cu Sn alloys relevant for lead-free soldering
Thermochim. ActaYear: 2008Volume: 472Pages: 1-10.
Keywords: Lead-free solders, Enthalpy of mixing, Liquid alloys, Calorimetry, Bi-Cu, Bi-Cu-Sn
DOI: 10.1016/j.tca.2008.02.023
ThermoML: http://trc.nist.gov/ThermoML/tca/j.tca.2008.02.023.xml
tin
Rechchach, M., Sabbar, A., Flandorfer, H., Ipser, H.
Enthalpies of Mixing of Liquid In-Sn and In-Sn-Zn Alloys
Thermochim. ActaYear: 2010Volume: 502Pages: 66-72.
Keywords: Enthalpy of mixing, lead free solders, liquid alloys, calorimetry, In-Sn, In-Sn-Zn
DOI: 10.1016/j.tca.2010.02.008
ThermoML: http://trc.nist.gov/ThermoML/10.1016/j.tca.2010.02.008.xml
tin
Flandorfer, H., Saeed, U., Luef, C., Sabbar, A., Ipser, H.
Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag Sn, Cu Sn and Ni Sn intermetallic compounds
Thermochim. ActaYear: 2007Volume: 459Pages: 34-39.
Keywords: Calorimetry, Enthalpy of formation, Lead-free solder alloy, Intermetallic compounds
DOI: 10.1016/j.tca.2007.04.004
ThermoML: http://trc.nist.gov/ThermoML/tca/j.tca.2007.04.004.xml
tin
Z. Guo, M. Hindler, W. Yuan and A. Mikula
Thermodynamic properties of liquid Au-Cu-Sn alloys determined from electromotive force measurements
Thermochim. ActaYear: 2011Volume: 525Pages: 183-189.
Keywords: Au-Cu-Sn alloys, Activity, Thermodynamic properties, Electromotive force
DOI: 10.1016/j.tca.2011.08.011
ThermoML: http://trc.nist.gov/ThermoML/10.1016/j.tca.2011.08.011.xml
tin
Saatci, B., Marasly, N., Guenduez, M.
Thermal conductivities of solid and liquid phases in Pb Cd and Sn Zn binary eutectic alloys
Thermochim. ActaYear: 2007Volume: 454Pages: 128-134.
Keywords: Thermal conductivity, Radial heat flow, Directional solidification, Pb Cd alloy, Sn Zn alloy
DOI: 10.1016/j.tca.2007.01.009
ThermoML: http://trc.nist.gov/ThermoML/tca/j.tca.2007.01.009.xml
tin
Li, D.[Dajian], Delsante, S.[Simona], Gong, W.[Weiping], Borzone, G.
Partial and Integral Enthalpies of mixing of Ag-Ga-Sn liquid alloys
Thermochim. ActaYear: 2011Volume: 523Pages: 51-62.
Keywords: Ag Ga Sn system, Enthalpy of mixing, Calorimetry
DOI: 10.1016/j.tca.2011.04.032
ThermoML: http://trc.nist.gov/ThermoML/10.1016/j.tca.2011.04.032.xml
tin
D. Jendrzejczyk-Handzlik, M. Rechchach, W. Gierlotka, H. Ipser and H. Flandorfer
Enthalpies of mixing of liquid systems for lead free soldering: Cu-Sb-Sn system
Thermochim. ActaYear: 2011Volume: 512Pages: 217-224.
Keywords: Cu-Sb-Sn system, enthalpy of mixing
DOI: 10.1016/j.tca.2010.10.010
ThermoML: http://trc.nist.gov/ThermoML/10.1016/j.tca.2010.10.010.xml


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